Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn / Leong Yee Mei

Driven by the recent trend towards miniaturization of lead free electronic products, researchers are putting immense efforts to improve the properties and reliability of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC 105 (Sn-1.0Ag-0.5Cu) solder because...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Leong , Yee Mei
التنسيق:	أطروحة
منشور في:	2020
الموضوعات:	TJ Mechanical engineering and machinery

مواد مشابهة

Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
حسب: Ghani, Fitriah Abdul
منشور في: (2018)

Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
حسب: Yahya, Iziana
منشور في: (2016)

Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
حسب: Ridhai, Mohammed Noori
منشور في: (2010)

Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
حسب: Nadhrah, Murad
منشور في: (2021)

Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
حسب: Mohammad Hossein, Mahdavifard
منشور في: (2017)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
حسب: Tai, Siew Fong
منشور في: (2003)

The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
حسب: Maliessa Nabilah, Mazelan
منشور في: (2023)

Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions
حسب: Lee , Liu Mei
منشور في: (2013)

Characterization and corrosion behaviour of 96.5Sn-3.0Ag-0.5Cu solder on Cu substrate at different reflow reactions
حسب: Lee, Liu Mei
منشور في: (2013)

Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
حسب: Osman, Saliza Azlina
منشور في: (2008)

Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
حسب: Chellvarajoo, Srivalli
منشور في: (2016)

Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
حسب: Chellvarajoo, Srivalli
منشور في: (2016)

Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
حسب: Nabila, Tamar Jaya
منشور في: (2024)

Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
حسب: Abu Hassan, Nurfazlin
منشور في: (2009)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
حسب: Idris, Siti Rabiatull Aisha
منشور في: (2008)

Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
حسب: Ab Ghani, Noor Asikin
منشور في: (2016)

Effect Of Indium Addition On Microstructure, Wettability, Shear Strength And Creep Behavior Of Sn100c Solder
حسب: Abdullah, Nabihah
منشور في: (2019)

Effect of indium addition on microstructure, wettability, shear strength and creep behavior of sn100c solder
حسب: Abdullah, Nabihah
منشور في: (2019)

Microstructural characteristics and mechanical performance of Bi-Sb-Ni added Sn 3.0Ag-0.5Cu multicomponent lead-free solder alloy / Zhou Ding
حسب: Zhou , Ding
منشور في: (2024)

Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
حسب: Baser, Muhammad Fadlin Hazim
منشور في: (2020)

The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
حسب: Zakaria, Mohamad Fadley
منشور في: (2008)

Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
حسب: Mayappan, Ramani
منشور في: (2007)

Effects of Zn and A1 on corrosion characteristics of Sn-1.0Ag-0.5Cu alloys / Nurul Liyana Kamaruzaman
حسب: Nurul Liyana, Kamaruzaman
منشور في: (2018)

Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
حسب: Hashim, Md. Amin
منشور في: (2011)

Effect Of Grain Refinement Process Using Equal Channel Angular Pressing On The Properties And Corrosion Behaviour Of Sn-3.0ag-0.5Cu Solder
حسب: Abu Bakar, Nur Adriana Nazifa
منشور في: (2019)

Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
حسب: Krishna, Vidyatharran
منشور في: (2020)

Efficiency enhancement of photoelectrochemical water splitting by heterostructures Ag/MoS2/ZnO photoanode / Chia Mei Yuen
حسب: Chia , Mei Yuen
منشور في: (2022)

Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
حسب: Mayappan, Ramani
منشور في: (2007)

Visible-light photodegradation of nitrobenzene by microwave synthesized ZnO and its nanocomposites Ag/ZnO and Cu/ZnO
حسب: Sidi, Hauwa Aliyu
منشور في: (2014)

Effect of nickel doping into solder alloy and its strength between SnCu-Ni/immersion gold joint
حسب: Zetty Akhtar, Abd Malek
منشور في: (2017)

Electroplating Of Cu-Sn Alloys And Compositionally Modulated Multilayers Of Cu-Sn-Zn-Ni Alloys On Mild Steel Substrate [TS693. H282 2007 f rb].
حسب: Hariyanti, Hariyanti
منشور في: (2007)

Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
حسب: Kamarudin, Maslina
منشور في: (2015)

Cu2ZnSnS4 (CZTS) Thin Film Grown By Electrochemical Deposition For Solar Cell
حسب: Mrzog, Elmoiz Marghni Mkawi
منشور في: (2015)

'Interpretive genres' in natural history : a socio-cognitive perspective / Yee Chee Leong
حسب: Yee, Chee Leong
منشور في: (2012)

Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys / Loh Hwei Ling
حسب: Loh, Hwei Ling
منشور في: (2019)

Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175].
حسب: Duong, Ngoc Binh
منشور في: (2005)

Physicochemical and tribological analysis of chemically modified microalgae oil blends for Malaysian conditions / Cheah Mei Yee
حسب: Cheah , Mei Yee
منشور في: (2019)

Interfacial microstructure growth mechanism of lead-free solder using laser soldering
حسب: Muhammad Asyraf, Abdullah
منشور في: (2024)

Microstructural and Dielectric Properties of (Ba,Nb)(Ti,Cu)O₃-(BNTC) and (Ba,Nb)(Ti,Sn)O₃-(BNTS) Ceramics
حسب: Keophilavong, Somsathith
منشور في: (2003)

Principal technology leadership practices, teacher ICT competency, and teacher acceptance of School Management System (SMS) in Negeri Sembilan secondary schools / Leong Mei Wei
حسب: Leong, Mei Wei
منشور في: (2017)

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