Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package / Saif Wakeel
The complexity of cleaning caused by miniaturization of electronic packages and the drive towards cost reduction have recently led to the development of no-clean fluxes (NCF). In this study, characterization and effect of two commercial NCF namely NC-1 and NC-2 on the fine pitch flip-chip package we...
| المؤلف الرئيسي: | |
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| التنسيق: | أطروحة |
| منشور في: |
2021
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| الموضوعات: |