Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing

Ball grid array (BGA) packages are essential components in automotive applications, renowned for their compact form factor and high-density interconnections. However, the persistent issue of void formation within these packages poses a significant challenge to their performance and reliability. This...

書目詳細資料
主要作者:	Ng , Qian Qing
格式:	Thesis
出版:	2024
主題:	TJ Mechanical engineering and machinery

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