Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping
High temperature die attach material has excellent corrosion resistance, good ductility, good electrical volume resistivity. Therefore, die attach materials have been introduced for electronic packaging. Nanoparticles have high surface energies and was developed for the use at high operational tempe...
| المؤلف الرئيسي: | |
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| التنسيق: | أطروحة |
| منشور في: |
2017
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