The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating

Solder acts as a joining material in first level packaging such as controlled collapse chipconnection (C4). It helps to interconnect chip with substrate to provide electrical and mechanical continuity in electronic packaging. The quality of electronic packaging mostly relies on the solder joint that...

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Détails bibliographiques
Auteur principal:	Maliessa Nabilah, Mazelan
Format:	Thèse
Langue:	anglais
Publié:	2023
Sujets:	TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery
Accès en ligne:	http://umpir.ump.edu.my/id/eprint/39614/1/ir.The%20effect%20of%20different%20Sn-Ag-Cu%20%28SAC%29%20solder%20form%20on%20solder.pdf

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