Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
Laser technology has been applied in the electronic soldering for many years as one of its advantages known is the ability to set the process parameters to suit the individual solder joint requirements. This method of joining, ease the automation compared to the reflow soldering process which is the...
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| Format: | Thesis |
| Language: | English |
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2024
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| Online Access: | http://umpir.ump.edu.my/id/eprint/44665/1/Study%20on%20intermetallic%20compound%20formation%20and%20growth%20at%20the%20solder%20joint%20interface%20during%20laser%20soldering%20using%20sn-ag-cu%20powdered%20compact%20solder%20on%20copper%20pad.pdf |