A study of Sn-Ag-Cu solder interconnection behaviour under gamma radiation exposure
The resilience of microelectronic packaging to gamma radiation is a crucial factor in solder joint evaluation due to its impact on the reliability of electronics within radiation-prone environments. This study focused on tin-silver copper (Sn96.5Ag3.0Cu0.5; SAC305) solder joints durability due to ex...
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| Format: | thesis::master thesis |
| Langue: | anglais |
| Publié: |
2025
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| Accès en ligne: | https://ir.upnm.edu.my/handle/20.500.14847/113 |
| Abstract | Abstract here |