Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
The effect of various percentages of Al addition to the microstructure of bulk, intermetallic compound (IMC) formation, wetting properties and mechanical properties of Sn-0.3Ag-0.5Cu (SAC0305) solder alloy was investigated. SAC0305, SAC-0.5Al, SAC-1Al, SAC-1.5Al and SAC-2Al were prepared via casting...
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | الإنجليزية |
| منشور في: |
2015
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.usm.my/36878/ |
| Abstract | Abstract here |