Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow

Solder bump bridging (SBB) is a type microprocessor packaging defects in Flip-Chip or C4 interconnection layer. The presence of micro conductive contaminate particle in die-package layer which causes bridging between two or more adjacent solder bump. These contaminate particles are mainly comes from...

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書目詳細資料

主要作者:	Loo , Kean Ann
格式:	Thesis
語言:	英语
出版:	2017
主題:	TK Electrical Engineering. Electronics. Nuclear Engineering TK1-9971 Electrical engineering. Electronics. Nuclear engineering
在線閱讀:	http://eprints.usm.my/39584/
Abstract	Abstract here