Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
Solder bump bridging (SBB) is a type microprocessor packaging defects in Flip-Chip or C4 interconnection layer. The presence of micro conductive contaminate particle in die-package layer which causes bridging between two or more adjacent solder bump. These contaminate particles are mainly comes from...
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| Format: | Thèse |
| Langue: | anglais |
| Publié: |
2017
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| Accès en ligne: | http://eprints.usm.my/39584/ |
| Abstract | Abstract here |