Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol) which is meant for high-temperature die-attach applications has been developed. Various weight percent of Cu nanoparticles (20-80 wt%) has been lo...
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | الإنجليزية |
| منشور في: |
2015
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.usm.my/41125/ |