Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process

Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay co...

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书目详细资料
主要作者: Ang , Karen Huei Ling
格式: Thesis
语言:英语
出版: 2011
主题:
在线阅读:http://eprints.usm.my/41879/

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