CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods
The major trend in electronic industry is to make the products smarter, lighter, functional and highly compact, at the same time cheaper. This trend has necessitated stringent packaging requirements and the flip-chip technology has emerged as a promising option to tackle this issue. However, a seri...
| 第一著者: | |
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2010
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| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/41905/ |
| Abstract | Abstract here |