Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
The rapid development of electronic and microelectronic technology increases the demands for electronics device with flexible and light weight capability. Flexible printed circuit board (FPCB) which can be used to replace rigid printed circuit board (RPCB) is well equipped with those features. Howev...
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2017
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| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/46933/ |