Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages

The rapid development of electronic and microelectronic technology increases the demands for electronics device with flexible and light weight capability. Flexible printed circuit board (FPCB) which can be used to replace rigid printed circuit board (RPCB) is well equipped with those features. Howev...

書目詳細資料
主要作者:	Lim, Chong Hooi
格式:	Thesis
語言:	英语
出版:	2017
主題:	T Technology TJ1-1570 Mechanical engineering and machinery
在線閱讀:	http://eprints.usm.my/46933/
Abstract	Abstract here

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