Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method
The increased in input/output (I/O) density due to the demand of high performances in devices caused the routing density on printed circuit board increased. This caused the board size increases due to the increased of trace width and trace spacing. Apart from that, the consumers preferred a small...
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | الإنجليزية |
| منشور في: |
2017
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.usm.my/47315/ |