Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method

The increased in input/output (I/O) density due to the demand of high performances in devices caused the routing density on printed circuit board increased. This caused the board size increases due to the increased of trace width and trace spacing. Apart from that, the consumers preferred a small...

Description complète

Détails bibliographiques
Auteur principal:	Yusop, Nurul Khalidah
Format:	Thèse
Langue:	anglais
Publié:	2017
Sujets:	T Technology
Accès en ligne:	http://eprints.usm.my/47315/

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