Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method

The increased in input/output (I/O) density due to the demand of high performances in devices caused the routing density on printed circuit board increased. This caused the board size increases due to the increased of trace width and trace spacing. Apart from that, the consumers preferred a small...

書目詳細資料
主要作者:	Yusop, Nurul Khalidah
格式:	Thesis
語言:	英语
出版:	2017
主題:	T Technology
在線閱讀:	http://eprints.usm.my/47315/

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