Effect of indium addition on microstructure, wettability, shear strength and creep behavior of sn100c solder
Due to environmental concern of lead toxicity, the use of lead-free solder has been widely used in electronic packing industries. In finding alternative of lead-free solder to replace the current lead solder, the lead-free solder should have a melting point close to lead solder (183°C), has good wet...
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | الإنجليزية |
| منشور في: |
2019
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.usm.my/55444/ |
| Abstract | Abstract here |