Effect of indium addition on microstructure, wettability, shear strength and creep behavior of sn100c solder

عرض إصدارات أخرى (1)

Due to environmental concern of lead toxicity, the use of lead-free solder has been widely used in electronic packing industries. In finding alternative of lead-free solder to replace the current lead solder, the lead-free solder should have a melting point close to lead solder (183°C), has good wet...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Abdullah, Nabihah
التنسيق:	أطروحة
اللغة:	الإنجليزية
منشور في:	2019
الموضوعات:	T Technology TA401-492 Materials of engineering and construction. Mechanics of materials
الوصول للمادة أونلاين:	http://eprints.usm.my/55444/
Abstract	Abstract here

مواد مشابهة

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