Effect Of Grain Refinement Process Using Equal Channel Angular Pressing On The Properties And Corrosion Behaviour Of Sn-3.0ag-0.5Cu Solder
Due to the inherent toxicity of Pb, environmental regulations have been enforced to eliminate the usage of Pb-based solders in electronic devices. Sn-Ag-Cu alloys is an attractive candidate due to good mechanical properties, good wettability and low melting temperature. However, the reliability of S...
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | الإنجليزية |
| منشور في: |
2019
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.usm.my/56163/ |
| Abstract | Abstract here |