Modeling Of High Performance Surface Mount Molded Pqfp Packages
Surface mount plastic packaging technology has evolved in order to meet the stringent standards demanded by high density and low cost integrated circuits devices. The internal heatsink plastic quad flat pack (pqfp) has been developed to replace the traditional single layer pqfp in order to enha...
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| 格式: | Thesis |
| 語言: | 英语 |
| 出版: |
1996
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| 主題: | |
| 在線閱讀: | http://eprints.usm.my/63813/ |
| Abstract | Abstract here |