Modeling Of High Performance Surface Mount Molded Pqfp Packages
Surface mount plastic packaging technology has evolved in order to meet the stringent standards demanded by high density and low cost integrated circuits devices. The internal heatsink plastic quad flat pack (pqfp) has been developed to replace the traditional single layer pqfp in order to enha...
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| 格式: | Thesis |
| 語言: | 英语 |
| 出版: |
1996
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| 主題: | |
| 在線閱讀: | http://eprints.usm.my/63813/ |
| Abstract | Abstract here |
| 總結: | Surface mount plastic packaging technology has evolved in
order to meet the stringent standards demanded by high
density and low cost integrated circuits devices. The
internal heatsink plastic quad flat pack (pqfp) has been
developed to replace the traditional single layer pqfp in
order to enhance the package's electrical and thermal
performance. Higher external package warpage is observed on
heatsink package compared to the traditional package and
thus this might affect the reliability and performance of
the package.
This study aims to set some guidelines regarding the
standard design rules for heats ink sizes and die sizes for
28x28 mm pqfp heatsink package. This will lead to
improvement in the process assembly procedure and hence
reduction in leadframe cost. The software mechanica
developed by rasna corporation which utilizes the p-version
finite element method is used in this study to analyze the
impact of heatsink sizes and die sizes on the package
warpage and thermal performance of the package. |
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