Modeling Of High Performance Surface Mount Molded Pqfp Packages

• Main Author: Lee, March 1996
• Format: Thesis
• Language: English
• Published: 1996
• Subjects: QA1 Mathematics (General)
• Online Access: http://eprints.usm.my/63813/

Surface mount plastic packaging technology has evolved in order to meet the stringent standards demanded by high density and low cost integrated circuits devices. The internal heatsink plastic quad flat pack (pqfp) has been developed to replace the traditional single layer pqfp in order to enhance the package's electrical and thermal performance. Higher external package warpage is observed on heatsink package compared to the traditional package and thus this might affect the reliability and performance of the package. This study aims to set some guidelines regarding the standard design rules for heats ink sizes and die sizes for 28x28 mm pqfp heatsink package. This will lead to improvement in the process assembly procedure and hence reduction in leadframe cost. The software mechanica developed by rasna corporation which utilizes the p-version finite element method is used in this study to analyze the impact of heatsink sizes and die sizes on the package warpage and thermal performance of the package.