Modeling Of High Performance Surface Mount Molded Pqfp Packages

Surface mount plastic packaging technology has evolved in order to meet the stringent standards demanded by high density and low cost integrated circuits devices. The internal heatsink plastic quad flat pack (pqfp) has been developed to replace the traditional single layer pqfp in order to enha...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Lee, March 1996
التنسيق:	أطروحة
اللغة:	الإنجليزية
منشور في:	1996
الموضوعات:	QA1 Mathematics (General)
الوصول للمادة أونلاين:	http://eprints.usm.my/63813/
Abstract	Abstract here

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