Statistical approach in solving for initial and eventual wire bonding problem
The project scope is related to solve the real life Semiconductor industrial problem.Interconnection processis identifiedas the most critical process among others compared to overall flow in Semiconductor Packaging. In semiconductor manufacturing industries, ball bonding and wedge bonding technique...
| 主要作者: | |
|---|---|
| 格式: | Thesis |
| 語言: | 英语 英语 |
| 出版: |
2013
|
| 主題: | |
| 在線閱讀: | http://eprints.utem.edu.my/id/eprint/14462/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=85240 |
| Abstract | Abstract here |