Statistical approach in solving for initial and eventual wire bonding problem

The project scope is related to solve the real life Semiconductor industrial problem.Interconnection processis identifiedas the most critical process among others compared to overall flow in Semiconductor Packaging. In semiconductor manufacturing industries, ball bonding and wedge bonding technique...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Somasundram, Suresh Kumar
التنسيق:	أطروحة
اللغة:	الإنجليزية الإنجليزية
منشور في:	2013
الموضوعات:	TK Electrical engineering. Electronics Nuclear engineering
الوصول للمادة أونلاين:	http://eprints.utem.edu.my/id/eprint/14462/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=85240
Abstract	Abstract here

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