Statistical approach in solving for initial and eventual wire bonding problem

The project scope is related to solve the real life Semiconductor industrial problem.Interconnection processis identifiedas the most critical process among others compared to overall flow in Semiconductor Packaging. In semiconductor manufacturing industries, ball bonding and wedge bonding technique...

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Bibliographic Details
Main Author:	Somasundram, Suresh Kumar
Format:	Thesis
Language:	English English
Published:	2013
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.utem.edu.my/id/eprint/14462/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=85240
Abstract	Abstract here

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