Determination of electrical measurement to detect poor thermal dissipation devices using TRIZ
Thermal dissipation of a microelectronic device is a topic of interest amongst the researchers because poor thermal dissipation may cause reliability problem during customer’s application. Researchers found that Leadframe, Solder Paste Material, Chip Metalization and Die Attach process contributed t...
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| Format: | Thesis |
| Language: | English English |
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2017
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| Online Access: | http://eprints.utem.edu.my/id/eprint/20621/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104240 |
| Abstract | Abstract here |