Effect of pad roughness on shear strength of thin small leadless package

Thin Small Leadless Packages (TSLP) have been manufactured to cater the current industry demand for a smaller electronic apparatus with a higher electrical performance. Previous studies showed the solder joint strength of leadless package with the printed circuit board (PCB) using Ni-P/Sn-0.5 Ag sol...

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Bibliographic Details
Main Author: Ong, Cheng Guan
Format: Thesis
Language:English
English
Published: UTeM 2018
Subjects:
T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utem.edu.my/id/eprint/23454/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=112834&query_desc=kw%2Cwrdl%3A%20Effect%20of%20pad%20roughness%20on%20shear%20strength%20of%20thin%20small%20leadless%20package
TJ211.42.L64 2017
Abstract Abstract here

Internet

http://eprints.utem.edu.my/id/eprint/23454/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=112834&query_desc=kw%2Cwrdl%3A%20Effect%20of%20pad%20roughness%20on%20shear%20strength%20of%20thin%20small%20leadless%20package
TJ211.42.L64 2017

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