Optimization Of Diebond And Wirebond To Improve Non Stick On Pad Issue

One of the largest losses in semiconductor assembly operations is non-stick on pad (NSOP) failures. NSOP failures are costly as the entire device will need to be rejected if there is one such failure on any bond pad. The review is aim to look at the failure modes associated with poor bond pad qualit...

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Bibliographic Details

Main Author:	Musa, Khaliza
Format:	Thesis
Language:	English English
Published:	2020
Subjects:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.utem.edu.my/id/eprint/25579/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119126
Abstract	Abstract here