Optimization Of Diebond And Wirebond To Improve Non Stick On Pad Issue

One of the largest losses in semiconductor assembly operations is non-stick on pad (NSOP) failures. NSOP failures are costly as the entire device will need to be rejected if there is one such failure on any bond pad. The review is aim to look at the failure modes associated with poor bond pad qualit...

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書誌詳細

第一著者:	Musa, Khaliza
フォーマット:	学位論文
言語:	英語 英語
出版事項:	2020
主題:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/25579/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119126
Abstract	Abstract here