Mechanical characterisation of hybrid GNPS and functionalised BN as a thermal interface material
Electronic industries are continually striving to miniaturise electronic devices that have high power density in many current technologies. This development has caused significant challenges in the removal of heat generated from the small devices, which gradually caused overheat, especially for the...
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| Format: | Thesis |
| Language: | English English |
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2021
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| Online Access: | http://eprints.utem.edu.my/id/eprint/25989/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121203 |
| Abstract | Abstract here |