A development of Time Domain Reflectometry (TDR) methodology to detect wire sweep defect in nearly short condition
Wire sweep is a common defect observed in power semiconductor devices, especially when bonded with thin aluminium wire (< 100μm). The conventional methods for detecting the wire sweep defect are Automatic Optical Inspection (AOI), Real-Time X-ray and Automatic Test Equipment (ATE). However, all t...
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| Format: | Thesis |
| Language: | English English |
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2023
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| Online Access: | http://eprints.utem.edu.my/id/eprint/28301/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=123813 |
| Abstract | Abstract here |