Synergistic effect of micro-nano fillers on reliability performance of hybrid electrically conductive adhesive
In today's digital age, the escalating demand for efficient electronic technologies contrasts starkly with the global issue of electronic waste (e-waste) containing hazardous lead (Pb) solder. Consequently, there is a critical need for alternative materials in electronics interconnection techno...
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English English |
| Published: |
2024
|
| Online Access: | http://eprints.utem.edu.my/id/eprint/29197/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=124396 |
| Abstract | Abstract here |