Synergistic effect of micro-nano fillers on reliability performance of hybrid electrically conductive adhesive

In today's digital age, the escalating demand for efficient electronic technologies contrasts starkly with the global issue of electronic waste (e-waste) containing hazardous lead (Pb) solder. Consequently, there is a critical need for alternative materials in electronics interconnection techno...

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Bibliographic Details
Main Author:	Adnan, Zainalfirdaus
Format:	Thesis
Language:	English English
Published:	2024
Online Access:	http://eprints.utem.edu.my/id/eprint/29197/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=124396
Abstract	Abstract here

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