Classical and damage mechanics-based models for lead-free solder interconnects

Solder joint reliability (SJR) is the key concern in electronics packaging, primarily for ball grid array (BGA) packages. It affects the overall performance and reliability of electronics devices. In this project, the response of Sn-4.0Ag-0.5Cu (SAC405) lead-free solder joints in a typical BGA packa...

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書目詳細資料

主要作者:	Lai, Zheng Bo
格式:	Thesis
語言:	英语
出版:	2009
主題:	TJ Mechanical engineering and machinery
在線閱讀:	http://eprints.utm.my/11344/1/LaiZhengBoMFKM2009.pdf