Classical and damage mechanics-based models for lead-free solder interconnects
Solder joint reliability (SJR) is the key concern in electronics packaging, primarily for ball grid array (BGA) packages. It affects the overall performance and reliability of electronics devices. In this project, the response of Sn-4.0Ag-0.5Cu (SAC405) lead-free solder joints in a typical BGA packa...
| 第一著者: | |
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2009
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| 主題: | |
| オンライン･アクセス: | http://eprints.utm.my/11344/1/LaiZhengBoMFKM2009.pdf |