Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish

समान संसाधन

• Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
  द्वारा: Idris, Siti Rabiatull Aisha
  प्रकाशित: (2008)
• Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
  द्वारा: Abu Hassan, Nurfazlin
  प्रकाशित: (2009)
• Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
  द्वारा: Tai, Siew Fong
  प्रकाशित: (2003)
• Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
  द्वारा: Ridhai, Mohammed Noori
  प्रकाशित: (2010)
• Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
  द्वारा: Krishna, Vidyatharran
  प्रकाशित: (2020)