Skip to content
MyTheses
Feedback
Book Bag:
0
items
(Full)
HOME
MYTHESES
BLOG
AI ASSISTANT
INSTITUTION
GUIDE & TUTORIAL
CONTACT
Language
English
Français
日本語
中文(简体)
中文（繁體）
اللغة العربية
हिंदी
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
Effect of isothermal aging on...
Cite this
Text this
Print
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
Add to Book Bag
Remove from Book Bag
Permanent link
Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
Bibliographic Details
Main Author:
Asri, Asma Kamarul
Format:
Thesis
Published:
2011
Subjects:
TJ Mechanical engineering and machinery
Holdings
Description
Similar Items
Staff View
Similar Items
Interfacial microstructure growth mechanism of lead-free solder using laser soldering
by: Muhammad Asyraf, Abdullah
Published: (2024)
Classical and damage mechanics-based models for lead-free solder interconnects
by: Lai, Zheng Bo
Published: (2009)
Study of interfacial reactions between lead-free solders and immersion silver finish
by: Oshaghi, Safoura
Published: (2008)
Temperature and strain-rate dependent damage-based models for lead-free solder interconnects
by: Mad Asasaari, Siti Faizah
Published: (2021)
Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
by: Boo, Nan Shing
Published: (2010)
