Skip to content
MyTheses
Feedback
书包:
0
items
(满)
HOME
MYTHESES
BLOG
AI ASSISTANT
INSTITUTION
GUIDE & TUTORIAL
CONTACT
语言
English
Français
日本語
中文(简体)
中文(繁體)
اللغة العربية
हिंदी
全文检索
题名
作者
主题
索引号
ISBN/ISSN
标签
检索
高级检索
Effect of isothermal aging on...
引用
发送短信
打印
导出纪录
导出到 RefWorks
导出到 EndNoteWeb
导出到 EndNote
添加到书包
从书包里删除
Permanent link
导出完成 —
Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
书目详细资料
主要作者:
Asri, Asma Kamarul
格式:
Thesis
出版:
2011
主题:
TJ Mechanical engineering and machinery
持有资料
实物特征
相似书籍
职员浏览
相似书籍
Interfacial microstructure growth mechanism of lead-free solder using laser soldering
由: Muhammad Asyraf, Abdullah
出版: (2024)
Classical and damage mechanics-based models for lead-free solder interconnects
由: Lai, Zheng Bo
出版: (2009)
Study of interfacial reactions between lead-free solders and immersion silver finish
由: Oshaghi, Safoura
出版: (2008)
Temperature and strain-rate dependent damage-based models for lead-free solder interconnects
由: Mad Asasaari, Siti Faizah
出版: (2021)
Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
由: Boo, Nan Shing
出版: (2010)