A unified constitutive model for solder materials
Solder joint reliability has been the main concern in electronic packaging since the advent of surface mount technology. In this study, a unified constitutive model was developed for finite element analysis of solder joint reliability. The model is based on the Anand model and Runge-Kutta time integ...
| मुख्य लेखक: | |
|---|---|
| स्वरूप: | थीसिस |
| भाषा: | अंग्रेज़ी |
| प्रकाशित: |
2004
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| विषय: | |
| ऑनलाइन पहुंच: | http://eprints.utm.my/5108/1/KohYeeKanMFKM2004.pdf |