The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON S...
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | Dissertation |
| اللغة: | الإنجليزية |
| منشور في: |
2004
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.uthm.edu.my/7636/ |
| Abstract | Abstract here |