| Résumé: | The objectives of the project is to investigate the characteristics contact resistance of
the silicon lead-frame interface using ECA die attach materials, and to evaluate the
factors contributing to the increase of interface resistively in semiconductor
packaging. This project was done at ON Semiconductor where silver-filler epoxy�based adhesive chips were investigated.
Tektronix 370B Programmable Curve Tracer with picoprobing is used to
measure RoN of the chips. Nondestructive techniques such as X-ray and SAM used to
examine internal defect and cross sectional analysis was done using SEM.
Few factors were found affect RoN. Those factors are capacitance due to trap
charges during fabrication, supply voltage, thermal management of the package,
delamination between die attachments, thickness of the epox)' and copper dioxide of
the lead-frame.
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