The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON S...
| Auteur principal: | Chua, King Lee |
|---|---|
| Format: | Thèse |
| Langue: | anglais |
| Publié: |
2004
|
| Sujets: | |
| Accès en ligne: | http://eprints.uthm.edu.my/7636/ |
| Abstract | Abstract here |
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