The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging

The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON S...

Description complète

Détails bibliographiques
Auteur principal: Chua, King Lee
Format: Thèse
Langue:anglais
Publié: 2004
Sujets:
Accès en ligne:http://eprints.uthm.edu.my/7636/
Abstract Abstract here

Documents similaires