Study of interfacial reactions between lead-free solders and immersion silver finish
Due to environmental considerations the use of lead-free solders has become common in electronic packaging industry. Among various lead-free solders available, near-eutectic Sn-Ag-Cu alloys are considered the most promising replacement of Sn Pb solders, and are widely used as lead-free solutions for...
| मुख्य लेखक: | |
|---|---|
| स्वरूप: | थीसिस |
| भाषा: | अंग्रेज़ी |
| प्रकाशित: |
2008
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| विषय: | |
| ऑनलाइन पहुंच: | http://eprints.utm.my/9546/1/SafouraOshaghiMFKM2008.pdf |