Study of interfacial reactions between lead-free solders and immersion silver finish
Due to environmental considerations the use of lead-free solders has become common in electronic packaging industry. Among various lead-free solders available, near-eutectic Sn-Ag-Cu alloys are considered the most promising replacement of Sn Pb solders, and are widely used as lead-free solutions for...
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2008
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| 主題: | |
| オンライン･アクセス: | http://eprints.utm.my/9546/1/SafouraOshaghiMFKM2008.pdf |