Study of interfacial reactions between lead-free solders and immersion silver finish

Due to environmental considerations the use of lead-free solders has become common in electronic packaging industry. Among various lead-free solders available, near-eutectic Sn-Ag-Cu alloys are considered the most promising replacement of Sn Pb solders, and are widely used as lead-free solutions for...

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書目詳細資料

主要作者:	Oshaghi, Safoura
格式:	Thesis
語言:	英语
出版:	2008
主題:	TJ Mechanical engineering and machinery
在線閱讀:	http://eprints.utm.my/9546/1/SafouraOshaghiMFKM2008.pdf