Electrodeposition of nickel/copper multi-nanolayer by dual bath technique at ambient temperature
The electrodeposition of Nickel/Copper (Ni/Cu) multi-nanolayer coating has been carried out on Cu substrate by using dual bath technique. The electrodeposition process was carried out at electrolyte temperatures of 25 °C, 40 °C, and 60 °C. The Watts electrolyte and Cu (II) sulphate solutions have be...
| 第一著者: | |
|---|---|
| フォーマット: | 学位論文 |
| 言語: | 英語 英語 英語 |
| 出版事項: |
2017
|
| 主題: | |
| オンライン･アクセス: | http://eprints.uthm.edu.my/9985/ |
| Abstract | Abstract here |