Classical and damage mechanics-based models for lead-free solder interconnects

Also available in printed version : TK7870.15 L344 2009 raf

Bibliographic Details
Main Author:	Lai Zheng Bo
Other Authors:	Mohd. Nasir Tamin, supervisor
Format:	Master's thesis
Language:	English
Published:	Universiti Teknologi Malaysia 2025
Subjects:	Electronic apparatus and appliances > Reliability Solder and soldering Joints (Engineering) > Reliability
Online Access:	https://utmik.utm.my/handle/123456789/115825
Abstract	Abstract here

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