Nawawi, N. S., & Haryati Yaacob, s. (2025). Adhesion of 14mm coated aggregate for chip seal application. Universiti Teknologi Malaysia.
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रNawawi, Nur Sarfina, और supervisor Haryati Yaacob. Adhesion of 14mm Coated Aggregate for Chip Seal Application. Universiti Teknologi Malaysia, 2025.
एमएलए (9वां संस्करण) प्रशस्ति पत्रNawawi, Nur Sarfina, और supervisor Haryati Yaacob. Adhesion of 14mm Coated Aggregate for Chip Seal Application. Universiti Teknologi Malaysia, 2025.
चेतावनी: ये उद्धरण हमेशा 100% सटीक नहीं हो सकते हैं.