Adhesion of 14mm coated aggregate for chip seal application

Also available in printed version

Détails bibliographiques
Auteur principal:	Nur Sarfina Nawawi
Autres auteurs:	Haryati Yaacob, supervisor
Format:	Bachelor thesis
Langue:	anglais
Publié:	Universiti Teknologi Malaysia 2025
Sujets:	Civil engineering
Accès en ligne:	https://utmik.utm.my/handle/123456789/46697
Abstract	Abstract here

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